| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for forming an external electrode of chip part where a conductive paste applied to a chip part element body in a second external electrode forming process cannot be released and the external electrode can be uniformly formed. SOLUTION: After a first external electrode forming process, a first carrier plate 3, an accommodation member 20, and a second carrier plate 3' are arranged up and down and a chip part element body 4 housed in a retention space 3c of the first carrier plate 3 is ejected to an accommodation space 23 of the accommodation member 20. A conductive paste applied in the first external electrode forming process is cooled and hardened in the accommodation space 23. In this manner, after the conductive paste 7 of the chip part element body 4 is cooled and hardened, the chip part element body 2 housed in the accommodation space 23 is pressed into a retention space 3c' of the second carrier plate 3' and the conductive paste 7 is applied to one edge portion of the chip part element body 4.</p> |
