| 摘要 |
A method and apparatus for molding an integrated circuit package is disclosed. In the method and apparatus for molding an integrated circuit package, by installing a die chip on a lead frame(10) which does not have a damber, wherein the damber does not connect each of leads(11) composing of the lead frame(10) and a preventing means for preventing a leakage of materials for die casting is provided. Thereby, a problem of leakage damage can be solved, resulting in improving a quality of the device.
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