PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a package by which respective electrodes of a semiconductor integrated circuit element housed at the inside can be electrically connected precisely to a prescribed external electric circuit. SOLUTION: A package is composed of: a mounting part, which is composed of an electric insulating material and mounts a semiconductor element 3 on the surface; an insulating base body 1 which comprises many recessed parts 1b on the rear surface; a plurality of metallized wiring layers 5 which are derived from the periphery of the mounting part, which mounts the semiconductor element 3; the insulating base body 1 up to bottom faces of the recessed parts 1b; a plurality of connecting pads 5a which are formed on the whole inner faces of the recessed parts 1b in the insulating base body 1 and to which the metallized wiring layers 5 are connected electrically; and terminals 7 which are brazed to the connecting pads 5a and which comprise spherical protrusion parts 7a on the rear surface of the insulating base body 1. The diameter of every spherical protrusion part 7a at every terminal 7 is designated as D1 , the diameter of the opening diameter of every recessed part 1b is designated as D2 , and the depth of every recessed part is designated as (d). Then, the package satifies requiments of D2 =0.05 (mm) and 0,08<=(d)/D2 <=0.85.