摘要 |
A multichannel optical connection process starts with making a wafer having a plurality of optical outlets disposed on a common face. The wafer is then disposed on a support having mechanical positioning arrangements, after which the assembly comprising the connecting wafer and the support is aligned with a reference termination having a base with mechanical positioning arrangements and a plate with at least two optical outlets disposed in the same configuration as the connecting plate. The two outlets of the wafer are then dynamically aligned with the outlets of the plate by three independent relative displacements of the wafer and the support. The wafer is fixed to the support when the alignment is achieved.
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