发明名称 POSITIVE RESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a compsn. having high sensitivity and high resolution of quarter micron or below and excellent in heat resistance, etc. SOLUTION: This compsn. consists of a resin component whose solubility to an aq. alkali soln. is increased by the action of an acid, a compd. which generates the acid when irradiated and an org. carboxylic acid compd. The resin component is a mixture of polyhydroxystyrene having a wt. average mol.wt. of 8,000-22,000 and having residues represented by the formula (where R<1> is H or methyl, R<2> is methyl or ethyl and R<3> is 1-4C lower alkyl) and substd. for 10-60mol% of the hydroxyl groups with polyhydroxystyrene having a wt. average mol.wt. of 8,000-22,000 and having tert-butoxycarbonyloxy groups substd. for 10-60mol% of the hydroxyl groups.
申请公布号 JPH0922117(A) 申请公布日期 1997.01.21
申请号 JP19950191020 申请日期 1995.07.05
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SATO KAZUFUMI;NITTA KAZUYUKI;YAMAZAKI AKIYOSHI;SAKAI TOMOAKI;NAKAYAMA TOSHIMASA
分类号 G03F7/004;C08F12/22;C08F212/00;C08G2/00;C08L25/00;C08L25/18;G03F7/039;H01L21/027;(IPC1-7):G03F7/039 主分类号 G03F7/004
代理机构 代理人
主权项
地址