| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a bonding wire with reliability capable of using a low-cost resin package with high corrosion resistance and ball bonding with high productivity without generating a hard oxide film on the surface of the wire. SOLUTION: After an oxide film removing treatment is conducted on the surface of an aluminum wire or aluminum alloy wire, it is covered with gold by dry plating, further the wire is inserted into a gold tube, or wound with a gold foil, then swaged via two or more passes by the area reducing rate of 50 to 80% per one pass, and then wire drawn to provide a gold film having a thickness of 0.1 to 3μm. |
