MANUFACTURE OF PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method wherein a post can be formed without using nonelectrolytic plating, when a printed circuit board in which a lower layer conductor circuit is electrically connected with an upper layer conductor layer by using the post. SOLUTION: Before a metal film 13 for forming a lower layer conductor circuit is patterned, a post 17 is formed on the metal film 13 by electrolytic plating using the metal film 13 as a feeding body. A mask 21 for covering the surface of a part of the metal film 13 which part is to be left as a lower conductor circuit and for covering the post 17 is formed on the metal film 13 on which the post 17 has been formed, by electrolytic plating. By etching a part of the metal film 13 which part is not covered with the mask 21, a lower layer conductor circuit 13a is formed.