| 摘要 |
PCT No. PCT/DE94/01090 Sec. 371 Date Mar. 19, 1996 Sec. 102(e) Date Mar. 19, 1996 PCT Filed Sep. 20, 1994 PCT Pub. No. WO95/08833 PCT Pub. Date Mar. 30, 1995A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such a way that the metal oxide is at least partially reduced to metal at least on the solder side at the surface and in the subsurface region of the contact facing. The reduction can be carried out by heat treatment in reducing atmosphere. In the case of contact materials based on silver/iron oxide (AgFe2O3/Fe3O4), in particular, the iron oxide may also be reduced to iron on the switching side since iron oxide is again formed after switching. Alternatively, contact facings may be provided with carbon as reducing agent on the solder side. In particular, the reduction may take place locally in this case. |
