MULTIPLE HEAT CONDUCTION PATH FOR INTENSIFYING HEAT/DISSIPATION AND INTEGRATED CIRCUIT PACKAGE CONSISTING OF CAP SURROUNDINGEDGE FOR IMPROVING PACKAGE INTEGRITY AND RELIABILITY

摘要

PROBLEM TO BE SOLVED: To provide a new IC packaging structure which protects an IC chip by installing a means of improved thermal conductivity. SOLUTION: A chip cap 110 is composed of thermally conductive material, and includes a heat sink 130 means for dispersing the heat generated from an IC chip 105. An adaptor board 120 includes a plurality of coupling vias 150 and a plurality of conductive metal balls forming a ball grid arrangement(BGA) 160 under the adaptor board 120. The IC chip 105 is electrically and thermally brought into contact with the BGA 160 by filling the coupling vias 150 with conductive material. A printed wiring board PCB 170 is used in order to retain and accept the adaptor board 120 on the PCB 170, and includes a plurality of thermal vias which penetrate the PCB 170, correspond to a plurality of the conductive metal balls of the BGA 170, and are in contact with them. The thermal vias are filled with thermally conductive material and disperse the heat generated from the IC 105.