INTERCONNECTION STRUCTURE TO PT ELECTRODE ON SIC

摘要

PROBLEM TO BE SOLVED: To eliminate the release of a Pt electrode from SiC without deteriorating the resistivity of the electrode when an interconnection material having heat resistance is provided at the electrode and used in a high-temperature environment. SOLUTION: The structure for interconnecting a Pt electrode 12 formed on SiC 11 is provided. An Au layer 13 and a nitride layer 14 like TiNx are sequentially formed in this order on the electrode 12, and an interconnection material 15 made of a high melting point metal like Mo, W or its silicide is connected to the layer 14.