| 摘要 |
PROBLEM TO BE SOLVED: To protect a chip component from the fall-off from a component holder by a method wherein a pasted surface is separated from the chip component while the chip component is supported by a support means and, when the pasted surface is completely separated from the chip component, the chip component is released from the support by the support means. SOLUTION: A base plate 1 is elevated with a support unit 2 and the upper surface of the base plate 1 is pressed against the end part of a chip component C which is held by a component holding plate. After that, while the support unit 2 is left at a pressing position, the base plate 1 only is made to descend and, when the base plate 1 is completely separated from the end part of the chip component C, the support unit 2 is made to descend and the chip component C is released from the support by support wires 2b. As the upper surface, which is to be a pasted surface, of the base plate 1 is coated with electrode paste P uniformly with a constant thickness, if the base plate 1 and the support unit 2 are made to descend in this order after the pressing, an electrode P' can be applied to the end part of the chip component C with a dimension corresponding to a coating thickness. |
