发明名称 |
METHOD OF FORMING OUTER ELECTRODE OF ELECTRONIC COMPONENT AND COMPONENT HOLDER USED FOR THAT METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a method by which the outer electrodes of electronic components can be formed with stable paste coating thicknesses. SOLUTION: A component holder 1 which can hold a chip component C in its inner hole elastically is used. The chip component C is pushed into the component holder 1 and held while the end part of the chip component C is made to protrude. In the holding state, electrode paste is applied to the protruding end part of the chip component C to form an outer electrode on the chip component. |
申请公布号 |
JPH0922849(A) |
申请公布日期 |
1997.01.21 |
申请号 |
JP19950171922 |
申请日期 |
1995.07.07 |
申请人 |
TAIYO YUDEN CO LTD |
发明人 |
TAKAKUWA SATOSHI;INAI MASAYUKI |
分类号 |
H01C17/00;H01C17/28;H01G13/00 |
主分类号 |
H01C17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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