发明名称 METHOD OF FORMING OUTER ELECTRODE OF ELECTRONIC COMPONENT AND COMPONENT HOLDER USED FOR THAT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a method by which the outer electrodes of electronic components can be formed with stable paste coating thicknesses. SOLUTION: A component holder 1 which can hold a chip component C in its inner hole elastically is used. The chip component C is pushed into the component holder 1 and held while the end part of the chip component C is made to protrude. In the holding state, electrode paste is applied to the protruding end part of the chip component C to form an outer electrode on the chip component.
申请公布号 JPH0922849(A) 申请公布日期 1997.01.21
申请号 JP19950171922 申请日期 1995.07.07
申请人 TAIYO YUDEN CO LTD 发明人 TAKAKUWA SATOSHI;INAI MASAYUKI
分类号 H01C17/00;H01C17/28;H01G13/00 主分类号 H01C17/00
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