| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component which enhances the heat dissipating efficiency of a module with a mounted heat generating element and increases density by a method wherein the heat generating element and other electronic components are mounted on a metal board as a heat sink. SOLUTION: A metal board 14 which functions as a heat is formed of a metal member, e.g. copper, aluminum or the like, whose thermal conductivity is good. A conductor circuit 19 is formed, via an insulating film 18, on the component mounting face of the metal board 14, and an IC chip 11 as a heat generating component is mounted on respective terminal parts of the conductor circuit 19. Heat which is generated from the IC chip 11 is conducted through the metal board 14 whose thermal conductivity is good, and the heat is dissipated, with good efficiency, to the outside from the heat dissipating face of the metal board 14 which is exposed from a molding resin 15. Thereby, the heat dissipating efficiency of a module 10 with the mounted IC chip 11 as the heat generating element is enhanced, and the density of an electronic component can be made high. |
