| 摘要 |
1,043,942. Soldering. MOTOROLA Inc. May 7, 1965 [May 20, 1964], No. 19393/65. Heading B3R. [Also in Division H1] In a method of soldering the interconnecting aluminium leads and contacts of semiconductor components a film of germanium is placed between the two aluminium surfaces to be joined and the temperature is raised to above the aluminium-germanium eutectic temperature to form an alloy which solders the surfaces together. The soldering is done in an inert atmosphere or in a mildly reducing atmosphere such as a mixture of nitrogen and hydrogen gas. In the embodiments described aluminium fingers 19, Figs. 1 and 2 (not shown), are soldered to bonding islands 15 on an integrated circuit formed by a silicon substrate 12 having a silicon dioxide or other di-electric film 13 and aluminium strips 16. A small weight may be placed on the finger to press the germanium film 22 on to the bonding island. Fig. 3 (not shown) shows a completely assembled integrated circuit device 30 with leads 33 which extend into the device for soldering to appropriate bonding islands. Separate integrated circuits may be connected together as shown in Fig. 4 (not shown), where four circuits 46, 47, 48, 49 with bonding islands 55 are placed in recesses in the bottom of. a flat header 50 and a glass lid 40 with aluminium strips 43 and pads 41 is placed on top and the assembly is heated to solder leads 54 and bonding islands 55 to the pads 41 and also solder the separate circuits 46, 47, 48, 49 into their recesses. |
