| 摘要 |
PROBLEM TO BE SOLVED: To provide relatively inexpensive wire bonding technique which can lower the height of a loop. SOLUTION: A microelectronics device 7 loaded with a bond pad 5, a lead finger 9, and a wire 1 are prepared. First, a ball 21 is bonded to the bond pad. The ball 21 is preferably made of gold, and it has electric fitness with the material of a wire. One end of the wire is connected to the lead finger 9 by a ball bond 23, and then the other end of the wire is connected to the ball 21, whereby the connection is completed. Since there is no wire loop on the bond pad, the height of the loop can be made lower.
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