| 摘要 |
PURPOSE: To improve soldering, reinforce a heat-resistant stress characteristic and enhance workability by a method wherein bending is performed in a mount conductive part using a thin lead frame material, or a thin plate is secured, or an opening is opened in the mount conductive part, or these are combined with each other. CONSTITUTION: A mount conductive part 4 is processed so that a chip mounting face 9 onto which a semiconductor chip 1 is mounted is projected, and the chip mounting face 9 is made more large than an external form of the semiconductor chip 1, and the semiconductor chip 1 is mounted onto this chip mounting face 9 via solder 2. Further, a lead frame 3 comprises the mount conductive part 4, a connection part 5, and terminal parts 6a, 6b, 6c.
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