发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device called 'system module' obtained by stacking a plurality of semiconductor elements, which can reduce crosstalk noises induced between the semiconductor elements. SOLUTION: A first semiconductor element 1 having first electrode pads 2 and a first wiring layer 9 is superposed on a second semiconductor element 5 having second electrode pads 6 and a second wiring layer 10 to form a semiconductor device. In this semiconductor device a conductor layer 7 is formed on an insulating layer 8 in the second semiconductor element 5.
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申请公布号 |
JPH0917945(A) |
申请公布日期 |
1997.01.17 |
申请号 |
JP19960100916 |
申请日期 |
1996.04.23 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
YOSHIDA TAKAYUKI;OTSUKA TAKASHI;FUJIMOTO HIROAKI;MIMURA TADAAKI;YAMANE ICHIRO;YAMASHITA TAKIO;MATSUKI TOSHIO;KASUGA YOSHIAKI |
分类号 |
H01L25/18;H01L25/065;H01L25/07;(IPC1-7):H01L25/065 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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