发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device called 'system module' obtained by stacking a plurality of semiconductor elements, which can reduce crosstalk noises induced between the semiconductor elements. SOLUTION: A first semiconductor element 1 having first electrode pads 2 and a first wiring layer 9 is superposed on a second semiconductor element 5 having second electrode pads 6 and a second wiring layer 10 to form a semiconductor device. In this semiconductor device a conductor layer 7 is formed on an insulating layer 8 in the second semiconductor element 5.
申请公布号 JPH0917945(A) 申请公布日期 1997.01.17
申请号 JP19960100916 申请日期 1996.04.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YOSHIDA TAKAYUKI;OTSUKA TAKASHI;FUJIMOTO HIROAKI;MIMURA TADAAKI;YAMANE ICHIRO;YAMASHITA TAKIO;MATSUKI TOSHIO;KASUGA YOSHIAKI
分类号 H01L25/18;H01L25/065;H01L25/07;(IPC1-7):H01L25/065 主分类号 H01L25/18
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