发明名称 CERAMICS MULTILAYER BOARD
摘要 <p>PURPOSE: To provide an easy-to-manufacture ceramics multilayer board which generates cracks little by impact load, etc., from an outside and is excellent in surface mounting property and durability. CONSTITUTION: A buffer material 3 constituted of a material whose tenacity value is higher than that of ceramics constituting a ceramics multilayer board body 2 is applied to an outer circumferential part of the ceramics multilayer board body 2 whereon a semiconductor element 5 is mounted. It is proper that the ceramics are constituted of aluminum nitride and the buffer material 3 can be formed of a resin, metal or zirconia base matter.</p>
申请公布号 JPH0917907(A) 申请公布日期 1997.01.17
申请号 JP19950160773 申请日期 1995.06.27
申请人 TOSHIBA CORP 发明人 MONMA JUN;NAKAYAMA NORIO
分类号 H05K3/46;H01L23/13;(IPC1-7):H01L23/13 主分类号 H05K3/46
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