| 摘要 |
<p>PURPOSE: To ensure the strength of joints between inner leads and wires without increases in material cost due to increases in the length of wires or increase in manufacturing cost due to increases in processing time in a semiconductor device of such a stricture that a semiconductor pellet and inner leads are connected with each other by wire bonding. CONSTITUTION: Second inner leads 6 are placed between first inner leads 5. The ends of the first inner leads 5 are extended toward an island 2 as far as their width is processable. The second inner leads 6 are extended closer to the island 2 than the ends of the first inner leads 5 are, and the ends of the second inner leads 6 are widened. These inner leads of two types are coupled with each other and secured in the direction of the row using an insulating tape 3 extending from the ends of the first inner leads 5 to the widened ends of the second inner leads 6. The bonding pads on the pellet 1 and the inner leads 5, 6 are connected with each other by a bonding wire 4 bridging the insulating tape 3.</p> |
