WIRING BOARD AND SEMICONDUCTOR DEVICE RECEIVING PACKAGE USING IT AND PACKAGING STRUCTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To maintain a strong and stable connection state for a long term by using a sintered material, having a specific value of a linear thermal expansion coefficient at a temperature in a specific range, produced by baking a molded body containing a filler in a ratio within a specific of value, which filter containing a metal oxide whose linear thermal expansion coefficient is not less than a specific value. SOLUTION: As an insulating board for a package, a molded body containing 20-80volume% of lithium silicic acid glass having 5-30weight% of Li2 O and a yielding point of 400 deg.C-800 deg.C and 80-20volume% of a filler containing a metal oxide whose linear thermal expansion coefficient is not less then 6ppm/ deg.C at 40 deg.C-400 deg.C, is sintered. Further, by using the sintered body having a linear thermal expansion coefficient of 8-18ppm/ deg.C at 40 deg.C-400 deg.C, the linear thermal expansion coefficient of the sintered body can easily be controlled in the range of 8-18ppm/ deg.C and the sintered body can be manufactured with improved reproducibility. Thus, the semiconductor device received in the container can be electrically connected accurately and strongly for a long term.