发明名称 MULTI-BEAM SEMICONDUCTOR LASER DEVICE
摘要 PURPOSE: To dispense with a partitioning plate preventing a mutual interference by a method wherein semiconductor laser chips are arranged around a reflecting mirror, and laser beams emitted from the semiconductor laser chips are reflected by the reflecting mirror so as to be emitted in required directions. CONSTITUTION: Laser beam emitted from semiconductor laser chips 2 are made to impinge on the reflecting surfaces 4a of a reflecting mirror 4 at an angle of 45 decrees and reflected in a direction which makes an angle of 90 degrees with an angle of incidence, the luminous points of the four semicondctor laser chips 2 are located at the apexes of a square possessed of sides each 300μm in length. As the laser rays are reflected by the pyramid-shaped reflecting mirror 4, the luminous points are optically located closer to each other, and the optical axes of the reflected laser rays of luminous regions are indicated by arrows 8, so that laser beams seem to be emitted from the apexes of a square 100μm square. Therefore, the semiconductor laser chips can be separately monitored by a singe photodetector 1, so that an effective multi-beam (maximum luminous points 4) semiconductor laser device can be obtained through an optical system of a single lens.
申请公布号 JPH0918087(A) 申请公布日期 1997.01.17
申请号 JP19950160586 申请日期 1995.06.27
申请人 NEC CORP 发明人 YAMADA HIDEYUKI
分类号 G11B7/125;G11B7/135;H01S5/00 主分类号 G11B7/125
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