SEMICONDUCTOR LASER PACKAGING BODY AND ITS MANUFACTURE

摘要

PURPOSE: To optically couple plural lines of optical fibers with respect to plural pieces of surface light emitting lasers formed on a semiconductor substrate by a mechanical positioning. CONSTITUTION: Plural surface light emitting lasers 102 are formed on the first main surface of a semiconductor substrate 101 and plural guide holes 103 are formed on the second main surface of the substrate. The first main surface of the semiconductor substrate 101 is brought into contact with a supporting substrate 105 to fix the substrate 101 to the substrate 105 and top ends of optical fiber tapes 106 are abutted on the second main surface. Centers of light beams 111 to be emitted from the surface light emitting lasers 102 and centers of guide holes 103 are positioned so as to become almost the same positions at the second main surface of the semiconductor substrate 101 and diameters of the guide holes 103 and the diameters of coated optical fibers 107 are almost same. At the top ends of optical fiber tapes 106, coated optical fibers 107 are exposed from coating material a little to be inserted into the guide holes 103.