| 摘要 |
PURPOSE: To provide a multilayer wiring board with improved reliability of connection between upper and lower wirings. CONSTITUTION: After an organic insulating film having a contact hole is formed on the lower layer wiring, through following successive processes, a multilayer wiring board, whose upper layer and lower layer wirings are connected together through the contact hole, is manufactured. Namely, (a) a process for cleaning the lower layer wiring exposed within the contact hole by non-reactive dry etching, (b) a process for forming a predetermined pattern of the upper layer wiring on the surface of the insulating film, and (c) a process for removing a quality-changed layer in the surface of the insulating layer by reactive dry etching, are carried out. |
