| 摘要 |
PURPOSE: To conduct efficiently the movement of head and to increase the heat exchange power of a thermoelectric conversion device as the whole device by a method wherein a liquid heat moving medium is fed in a manner that the liquid heat moving medium collides with the surface supporting a semiconductor layer on a substrate, and the surface opposite to that surface. CONSTITUTION: Water 21, which is a heat moving medium, simultaneously spreads in a first space 17, being fed through a central feeding tube part 8, and is jetted forcibly toward the plane of a heat dissipation side substrate 4 through 9 pieces of feed openings 16a to 16i. The water 21, which collides with the substrate 4 to absorb the heat of the substrate 4, is diffused in a second space 19 with a narrow gap, is collected in water collecting channels 20 on the periphery of the space 19, is sent to a drainage line 9 from discharge orifices 15 closes to the water channels 20 via drains 18 and is discharged outside a system through the drainage line 9. That is, a thermoelectric conversion device is formed into such a structure that the water 21 is fed so as to collide with the heat transfer surface of the substrate 4 to absorb heat from the substrate 4, and moreover, since the flow path length of the water 21 is shorter compared with that of water in a conventional thermoelectric conversion device, and the device has little pressure loss, the thermal conductance of the device is large and the device has superior characteristics. |
