| 摘要 |
PROBLEM TO BE SOLVED: To obtain a circuit connection structure for board in which a high current can be fed to the joint of upper and lower patterns on the board by fixing press contact devices on the pattern and then connecting the press contact devices through a connection part. SOLUTION: Upper and lower patterns 11, 12 are formed on the upper and lower surfaces of a board 10 and electronic devices constituting a circuit are mounted thereon. At first, a press contact device 20 is mounted on the upper pattern 11 and subjected to reflow soldering 35. A connection part 30 is then inserted into press contact devices 20 soldered to the upper and lower patterns 11, 12 thus connecting the upper and lower patterns 11, 12 electrically. The connection part 30 has U-shape and made of a brass plate, for example. Since mechanical mounting and automatic soldering are realized, the quality is enhanced while allowing passage of high current. |
