发明名称 METHOD AND STRUCTURE FOR MOUNTING PRINTED BOARD
摘要 PROBLEM TO BE SOLVED: To facilitate the positioning of spacer and the fixing work of IC and heat sink while allowing simultaneous fixing of a plurality of spacers by positioning the spacer and a board relatively using positioning pins provided for the spacer. SOLUTION: A spacer 7 is provided, at the opposite ends thereof, with positioning pins 71 extending normally to the bottom face and, in the center thereof, with a plurality of pin holes 72 for receiving socket pins 7 wherein step holes 73 are provided on the opposite sides of the pin hole 72. A stud pin 82 having an internally threaded head part 81 to be mated with a bolt 3 is provided at the step hole 73 while projecting from the bottom face of spacer 7. A board 4 is provided with positioning holes in addition to through holes and bolt holes. The positioning pins 71 of a plurality of spacers 7 are inserted into the positioning holes of the board 4 and the stud pins 82 are inserted into the bolt holes of the board 4. The spacer 7 is brought into tight contact with the soldered face 41 of board 4 and soldered thereto on the mounting face 43 before securing a heat sink 1.
申请公布号 JPH0918113(A) 申请公布日期 1997.01.17
申请号 JP19950191126 申请日期 1995.07.03
申请人 YASKAWA ELECTRIC CORP 发明人 KASUYA SADAO
分类号 H05K13/04;H05K1/18 主分类号 H05K13/04
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