发明名称 CAPILLARY FOR BONDING
摘要 PURPOSE: To provide a capillary for bonding which can improve the number of times of consecutive bonding to the occurrence of abnormality in wireless bonding method and wire bonding method in spite of simple structure. CONSTITUTION: It is made possible to shorten the area where the crystal structure of the wire of the section right above a ball is coarse in bonding work, enlarging the external surface of a capillary more than the reference surface area in the case where the same external surface is a smooth surface not equipped with uneven form such as a capillary, by forming grooves 11 on the external surface of the capillary 1, thereby making the external surface uneven.
申请公布号 JPH0917821(A) 申请公布日期 1997.01.17
申请号 JP19950162197 申请日期 1995.06.28
申请人 TANAKA DENSHI KOGYO KK 发明人 MURAI HIROSHI;KOGASHIWA TOSHINORI;ARIKAWA TAKATOSHI;TAKAURA SHIN;AKIMOTO HIDEYUKI
分类号 H01L21/60;H01L21/321 主分类号 H01L21/60
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