SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To lower heating melting viscosity of an epoxy resin composite and fill it in a clearance part which is an extremely narrow space by setting a specific surface area of a filler for a specified ratio and specifying a grading composition of a filler. CONSTITUTION: A semiconductor chip 1 is mounted with the side of an electrode 11 facing a surface of an auxiliary wiring board 2. The auxiliary wiring board 2 is formed by laminating insulation layers 24, 25. A clearance between the semiconductor chip 1 and the auxiliary wiring board 2 is sealed by a curing body 3 of a resin composite. Sealing by the curing body 3 of a resin composite is sealing by transfer molding. A resin composite is an epoxy resin composite containing a filler and a specific surface area of a filler is at most 40m<2> /g. A ratio of a filler having a grain diameter of at least a thickness of a clearance between the semiconductor chip 1 and the auxiliary wiring board 2 in a filler is 15wt.% or less of an entire of an epoxy resin composite. Thereby, transfer molding can be applied and a sealing process of the semiconductor chip 1 can be made easy.