| 摘要 |
<p>A method of manufacturing a plurality of multilayer electronic components, comprising the steps of: (a) manufacturing a laminated sheet (1) in which layers (3, 3') of ceramic tape are each provided on one side with a pattern of electrodes (5, 5'), are stacked so that the electrode patterns (5, 5') on consecutive layers (3, 3') are offset back and forth with respect to one another, and are pressed together; (b) cutting the laminated sheet (1) into segments in which consecutive electrodes are alternately exposed at a different segment edge; (c) sintering the segments; (d) providing electrical contacts which interconnect the electrodes exposed at given segment edges, wherein the cutting step (b) is performed by directing a focused laser beam (7) onto the plane of the laminated sheet (1) and by effecting relative motion of the beam (7) with respect to the sheet (1) so as to trace the beam (7) along a selected cutting path (13), whereby the intercept (9) of the beam (7) and the sheet (1) is cooled by a flow of non-flammable gas.</p> |
