| 发明名称 |
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| 摘要 |
A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added. <IMAGE> |
| 申请公布号 |
JP2572042(B2) |
申请公布日期 |
1997.01.16 |
| 申请号 |
JP19860096622 |
申请日期 |
1986.04.25 |
| 申请人 |
OLIN CORP |
发明人 |
RONARUDO ENU KYARON;JON EFU BURIIDEISU |
| 分类号 |
C22F1/08;C22C9/06;C22F1/00;H01B1/02;H01L23/495;(IPC1-7):C22C9/06 |
主分类号 |
C22F1/08 |
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代理人 |
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| 地址 |
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