| 摘要 |
<p>A microwave circuit having a two-sided substrate (1) on which a microwave lead-through is arranged in the form of a symmetrical lead-through structure, being provided by opposite metallizationless areas on the upperside and the underside of the substrate and comprising a lead-through conductor (8), coplanar width adaption segments and first and second line segments (7, 9) connected thereto, the ground of said segments comprising opposite metallization parts (5a, 5a'; 5b, 5b') being inter-connected through via-holes (6). In a sealed microwave circuit a seal lead-through comprises said lead-through structure (7, 8, 9) and a microstrip line segment (10).</p> |
