发明名称 |
METHOD OF FORMING A MULTILAYER PRINTED CIRCUIT BOARD AND PRODUCT THEREOF |
摘要 |
In a process for fabricating a multilayer printed circuit board with permanent innerlayers of photoresist, the photoimageable composition used to form the hard permanent layer comprises a polymerizable acrylate monomer; an oligomer formed by the reaction of an epoxy resin and an acrylic or methacrylic acid; a photosensitive, free radical generating initiator for polymerization of the acrylic monomer and oligomer; a curable epoxy resin; a curing agent for the epoxy resin; and, optionally, a crosslinking agent reactive with hydroxyl groups. After exposure and development of a layer of the photoimageable composition and etching of the underlying metal layer on a board, the resultant photoresist is left on the circuitry traces. The innerlayers of photoresist are stacked in a press where it initially conforms under heat and pressure to fill voids between the innerlayers and then cures to permanence.
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申请公布号 |
CA2090099(C) |
申请公布日期 |
1997.01.14 |
申请号 |
CA19932090099 |
申请日期 |
1993.02.22 |
申请人 |
MORTON INTERNATIONAL, INC. |
发明人 |
RATH, JAMES;TRAN, WILLIAM LUONG-GIA;FLYNN, KATHY M.;TARA, VINAI MING |
分类号 |
G03F7/027;G03F7/038;G03F7/09;G03F7/26;H05K3/00;H05K3/06;H05K3/46;(IPC1-7):H05K3/46;H05K1/02;G03F7/028;H05K1/14;G03F7/16 |
主分类号 |
G03F7/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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