| 摘要 |
A distance between each two sides adjacent to a first portion X of the outer peripheral portion of an island portion 3 and the inner end of an inner lead portion 4 is set to d1 while the distance between each two sides adjacent to a second portion Y, which is diagonal to the first portion X, and the inner end of the inner lead portion 4 is set to d2 (<d1). The island portion 3 has a portion 2a for placing the semiconductor chip thereon and an overhang portion 3a attached to that portion. A semiconductor chip 2 is adhered on the island portion 3 of the lead frame 10, which is then attached in position within a mold. From a gate 21 a molten resin is injected into the cavity 23 in a diagonal direction of the square island portion, i.e. a direction from the first portion X toward the second portion Y.
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