| 摘要 |
PURPOSE: To produce a chip with good dimensional precision by a method in which a resinous paste is packed in the recessed holes of a molding mold in which a number of the recessed holes with a shape of the chip to be molded are formed, and after the paste being cured, the molded chip is demolded from a molding part. CONSTITUTION: The recessed holes 10 of a plate-shaped molding mold (mold) 11 having numbers of the holes 10 are filled with a paste (resinous paste) 12 of a synthetic resin or rubber containing a soft magnetic powder. Next, as necessity requires, the paste which adhered to the surface of the mold other than the holes 10 is removed. The resin paste in the hole 10 is cured adequately to make a chip, which is demolded. In the demolding, a film 14 is laid on the mold 11 and, preferably, is pressed by a roller etc. After the mold being cooled, the film 14 is peeled off from the mold 11. By peeling off the chip 15 from the film 14, the chip 15 of a product is produced. |
