| 摘要 |
PURPOSE: To obtain an adhesive composition, having both solder and long-term heat resistances, capable of forming a flexible adhesive layer and useful especially bonding a polyimide film to a copper foil. CONSTITUTION: This adhesive composition is obtained by blending [I] 100 pts.wt. sum total of (i) an aromatic polyamine and (2) an unsaturated compound or an oligomer having at least twoα,β-unsaturated groups in one molecule with [II] 1-100 pts.wt. acrylic rubber or hydrogenated butadiene-acrylonitrile copolymer rubber.
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