发明名称 METHOD FOR CUTTING FUSE WIRING OF INTEGRATED CIRCUIT
摘要 PURPOSE: To provide a method capable of stably cutting fuse wirings without increasing the irradiation quantity of a laser beam. CONSTITUTION: An integrated circuit chip 2 having the fuse wirings cuttable by the irradiation with the laser beam is arranged in a vacuum evacuatable vessel. The inside of this vacuum is so evacuated that a pressure lower than the atm. pressure is attained in the vessel. The fuse wirings are cut by irradiating the fuse wirings with the laser beam.
申请公布号 JPH0910975(A) 申请公布日期 1997.01.14
申请号 JP19950159341 申请日期 1995.06.26
申请人 FUJITSU LTD 发明人 KANEKO AKIRA
分类号 B23K26/00;B23K26/14;B23K26/38;H01L21/302;H01L39/00 主分类号 B23K26/00
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