发明名称 |
METHOD FOR CUTTING FUSE WIRING OF INTEGRATED CIRCUIT |
摘要 |
PURPOSE: To provide a method capable of stably cutting fuse wirings without increasing the irradiation quantity of a laser beam. CONSTITUTION: An integrated circuit chip 2 having the fuse wirings cuttable by the irradiation with the laser beam is arranged in a vacuum evacuatable vessel. The inside of this vacuum is so evacuated that a pressure lower than the atm. pressure is attained in the vessel. The fuse wirings are cut by irradiating the fuse wirings with the laser beam. |
申请公布号 |
JPH0910975(A) |
申请公布日期 |
1997.01.14 |
申请号 |
JP19950159341 |
申请日期 |
1995.06.26 |
申请人 |
FUJITSU LTD |
发明人 |
KANEKO AKIRA |
分类号 |
B23K26/00;B23K26/14;B23K26/38;H01L21/302;H01L39/00 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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