发明名称 Method of manufacturing solid state imaging device having high sensitivity and exhibiting high degree of light utilization
摘要 There are provided a solid state imaging device having high sensitivity and exhibiting high degree of light utilization and a method of manufacturing the same. An insulating film 42, a transfer electrode 43, a light shielding film 44, a protective film 45, and a flat layer 51 are formed above a layer having a photoelectric conversion portion, and a concave lens layer 52 is formed on the flat layer 51 to a lattice pattern. The concave lens layer 52 of the lattice pattern is hot melted for conversion into a concave type micro-lens 52. A resin layer 53 having a refractive index smaller than that of the concave lens 52, a buffer layer 54, and a convex type micro-lens 57 are sequentially formed above the concave type micro-lens 52. The concave type micro-lens 52 functions to bring light rays focused by the convex type micro-lens 57 to a position close to light incident vertically upon the photoelectric conversion portion 41.
申请公布号 US5593913(A) 申请公布日期 1997.01.14
申请号 US19950449835 申请日期 1995.05.24
申请人 SHARP KABUSHIKI KAISHA 发明人 AOKI, TETSURO
分类号 G02B27/00;G02B3/00;H01L27/14;H01L27/146;H01L27/148;H01L31/0232;H04N5/335;H04N5/359;H04N5/369;(IPC1-7):H01L31/18;H01L21/70;H01L27/00;G02B27/10 主分类号 G02B27/00
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