Werkwijze voor het inkapselen van een elektronische component, elektronische component geschikt te worden toegepast bij het uitvoeren van deze werkwijze en ingekapselde component verkregen onder toepassing der werkwijze.

摘要

Method for encapsulating, in a mould (48a,48b), an electronic component (30) having a number of laterally projecting elongated connecting elements (33) situated next to one another in one plane, said connecting elements being without metallic through connection and having a certain mutual pitch (PL), width (WL) and height (TL), and with the insertion of two films (8a,8b), each having a predetermined thickness (TFT and TFB, respectively), a deformable film being used and the encapsulation being carried out under conditions which are such that, during the process, the condition $at\; the\; position\; of\; the\; clamping\; edges\; of\; the\; matrix\; parts,\; while$ $$