发明名称 |
Method of forming contact pads for wafer level testing and burn-in of semiconductor dice |
摘要 |
A method of forming contact pads (140) that allows for wafer level testing and burn-in of semiconductor die (22). A plurality of semiconductor die (22) are formed upon a semiconductor wafer (20), each semiconductor die (22) having a plurality of bonding pads (78). A contact pad (140) is formed overlying each bonding pad (78) and is electrically coupled to the bonding pad (78) and to wafer test pads (38) through vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively) so that each semiconductor die (22) is uniquely identified. Contact pads (140) protect underlying bonding pads (78) during the formation and removal of vertical and/or horizontal wafer conductors (42-47 and 52-53 respectively). Thus, wafer level electrical testing and/or burn-in can be performed prior to designating a final packaging method for the semiconductor die (22).
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申请公布号 |
US5593903(A) |
申请公布日期 |
1997.01.14 |
申请号 |
US19960606472 |
申请日期 |
1996.03.04 |
申请人 |
MOTOROLA, INC. |
发明人 |
BECKENBAUGH, WILLIAM M.;LYTLE, WILLIAM H.;BERMAN, BERNARD |
分类号 |
G01R31/28;H01L23/485;(IPC1-7):H01L21/66 |
主分类号 |
G01R31/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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