| 摘要 |
PURPOSE: To obtain a semiconductor integrated circuit device by which the thermal resistance of an LSI package having a BGA-(ball grid array) structure is reduced, by which the warp of a subtrate is prevented and whose production yield is enhanced. CONSTITUTION: In an LSI package, a semiconductor chip 2 which is mounted on a printed-wiring board 1 and a heat spreader 11 which is arranged at the upper part of the semiconductor chip 2 are sealed with a molding resin 3. The rear of the printed-circling board 1 has a BGA structure in which solder bumps 8 have been bonded. The semiconductor chip 2 is mounted on the printed-wiring board 1 so as to interpose respective TAB leads 4. Elastomers 10a, 10b are interposed between the semiconductor chip 2 and the printed-wiring board 1 as well as between the semiconductor chip 2 and the heat spreader 11. |
