| 摘要 |
PURPOSE: To surely separate a multilayered wafer, one by one, without damaging the surface of the wafer, by combining a flat air nozzle with a swing air jet nozzle. CONSTITUTION: A multilayered wafer 1 is put on an elevating stage 6. The surface of a wafer on the uppermost surface of the multilayered wafer 1 is sucked by the suction part 5 of a robot suction nozzle 4. An air flow 9 which collides against a plurality of the wafers of the multilayered wafer is made to blow against the side surface of the multilayered wafer 1 from a flat air nozzle 3. The wafer is separated into blocks of two or three wafers. An air flow 8 is made to blow against the blocks from a swing air jet nozzle 2, thereby surely separating the multilayered wafer. |
