| 摘要 |
PURPOSE: To provide an electronic component device which is improved in function, reduced in size, and has a semiconductor device. CONSTITUTION: An electronic component device is provided with a multilayered printed board 3 having a stepped cavity 5 which is widened at every insulating layer 4, a first semiconductor device 1 mounted on the bottom 6 of the cavity 5, and a second semiconductor device 2 which is put on one footboard 7 sorrounding the bottom 6 of the cavity 5 across the bottom 6. Since the second semiconductor device 2 is provided above the first semiconductor device 1 in a three-dimension state, the area on the surface of the printed board 3 for mounting the semiconductor devices 1 and 2 can be reduced. |
