发明名称 HYDROGEN ABSORBING ALLOY FILM COMPOUND UNIT
摘要 PURPOSE: To provide a hydrogen absorbing alloy film compound unit wherein separating/coming off from a substrate of a hydrogen absorbing alloy film can be prevented as much as possible further to improve conductivity of the hydrogen absorbing alloy film with a thick film formable. CONSTITUTION: A device is constituted by a conductive substrate 2, conductive partitioning walls 3 vertically provided in a surface of this conductive substrate 2 and hydrogen absorbing alloy layers 4 formed so as to bury a space between these conductive partitioning walls 3. Here are formed the partitioning walls preferably in a lattice shape.
申请公布号 JPH097584(A) 申请公布日期 1997.01.10
申请号 JP19950150646 申请日期 1995.06.16
申请人 MITSUBISHI MATERIALS CORP 发明人 FUJINO SHUICHI;KANEMOTO MANABU;MIZUGUCHI AKIO;SUGIHARA TADASHI
分类号 H01M4/24;B81B1/00;B81C1/00;H01M4/86;H01M4/90 主分类号 H01M4/24
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