发明名称 |
HYDROGEN ABSORBING ALLOY FILM COMPOUND UNIT |
摘要 |
PURPOSE: To provide a hydrogen absorbing alloy film compound unit wherein separating/coming off from a substrate of a hydrogen absorbing alloy film can be prevented as much as possible further to improve conductivity of the hydrogen absorbing alloy film with a thick film formable. CONSTITUTION: A device is constituted by a conductive substrate 2, conductive partitioning walls 3 vertically provided in a surface of this conductive substrate 2 and hydrogen absorbing alloy layers 4 formed so as to bury a space between these conductive partitioning walls 3. Here are formed the partitioning walls preferably in a lattice shape. |
申请公布号 |
JPH097584(A) |
申请公布日期 |
1997.01.10 |
申请号 |
JP19950150646 |
申请日期 |
1995.06.16 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
FUJINO SHUICHI;KANEMOTO MANABU;MIZUGUCHI AKIO;SUGIHARA TADASHI |
分类号 |
H01M4/24;B81B1/00;B81C1/00;H01M4/86;H01M4/90 |
主分类号 |
H01M4/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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