| 摘要 |
PURPOSE: To polish any substrates with uniform polishing characteristics by providing on each substrate holder polishing means for adjusting surface roughness of a polishing cloth by bringing polishing particles held by each substrate holder into contact with the polishing cloth slidably. CONSTITUTION: A polishing cloth 1 is sticked over a rotary board 2, and a slurry like polishing agent 3 is supplied onto the polishing cloth 1 with polishing agent supply means 12, 13. Substrates 4, 5 held in close contact on the first and second substrate holders 6, 7 are brought into contact with the polishing cloth 1 slidably. First and second polishing heads 10, 11 are independently rotatably disposed at a predetermined position on each upstream side of the substrate holders 6, 7. Polishing particles 8, 9 are buried in the first and second polishing heads 10, 11, and surface roughness of the polishing cloth 1 is adjusted by rotating the heads and bring them into sliding contact with the polishing cloth 1. Hereby, polishing of the substrates 4, 5 is ensured with uniform polishing characteristics. |
