SEMICONDUCTOR WAFER FIXING ADHESIVE TAPE

摘要

PURPOSE: To provide the adhesive tape for dicing with which the chips of cutting can be prevented from remaining on the surface of a semiconductor wafer in a full cut dicing system. CONSTITUTION: The title adhesive tape is formed by laminating an adhesive agent layer A and a resin layer B, containing the constituent ingredient having the MFR 3 or smaller of test load 21.18N at the testing temperature 190 deg.C in the testing method shown by JIS K 7210 (flow test method of thermoplastic) and also having a carboxylic group (-COOH) as the constituent ingredient of polymer.