| 摘要 |
PURPOSE: To provide the manufacturing apparatus and the manufacturing method, of an electronic component with a bump, by which a mounting error is detected so as to be recovered automatically when a solder ball used to generate the bump is mounted on an electrode at a work. CONSTITUTION: A head 10 is moved to the upper part of a feed part 5, a solder ball 4 is vacuum-sucked so as to be moved to the upper part of a storage part 7, a flux 6 is applied to the solder ball 4, the head 10 is moved to the upper part of a board 1, and the solder ball 4 is mounted on an electrode 2 at the board 1. Then, the board 1 is observed with a camera 20, and whether the solder ball 4 has been mounted on the electrode 2 correctly or not is inspected. When it is O.K., the board 1 is sent to a heating furnace 29, When it is N.G., the solder ball 4 on the board 1 is sucked by a nozzle 21 so as to be collected, and the solder ball 4 is mounted again on the board 1 by the head 10. Consequently, when the solder ball 4 is mounted erroneously, it can be recovered immediately.
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