| 摘要 |
<p>PURPOSE: To obtain a package provided with an electronic-component cooling structure whose heat dissipating property and connecting reliability are excellent. CONSTITUTION: An electronic component 11 which is mounted on a circuit board 10 by connection means 12 such as solder balls or the like is brought into contact with a heat transfer block 15 composed of a nonplastic material in such a way that a lubricative heat transfer material 16 filled into a uniform and constant-interval gap (d) is interposed, a heat transfer layer 14 which is composed of a plastic heat transfer material and which has been impressed is bonded to the heat transfer block 15, and it is bonded to a cooling means 13 whose thermal conductivity is large. At their peripheral edge part, the cooling means 13 and the circuit board 10 are sealed with, and connected by, a sealing material 23 such as an O-ring or the like whose thickness is identical to the gap (d). Thereby, since the gap (d) between the heat transfer block and the electronic component is uniform and constant, a local temperature rise is not generated. The lubricative heat transfer material reduces a force, in the horizontal direction, which is applied to the connection means.</p> |
