| 摘要 |
<p>PURPOSE: To provide a wiring board for mounting use formed into a structure, wherein the reliability of the connection of bump electrodes with the input/output terminals of a semiconductor element, which is caused by an irregularity in the heights of the electrodes, can be improved, and to bring out the high-reliability function of the wiring board while the cost of the wiring board is prevented from being increased. CONSTITUTION: A wiring board for mounting use is formed into a structure, wherein the wiring board has a wiring board main body 4 for mounting use and bump electrodes 4a for connection use provided on the surface of the main body 4 and the point surfaces of the electrodes 4a are formed into a multilayer structure consisting of a high-hardness conductor layer 4a,. In more concrete terms, the wiring board is formed into a structure, wherein the bump electrodes 4a, which are connected with input/output terminals of a semiconductor element, are provided on the surface of the main body 4, the sides, which face the surfaces of conductor pads 4b1 of the electrodes 4a are formed into a multilayer structure consisting of a comparatively low-hardness conductor layer 4a1 and the point surfaces of the electrodes 4a are formed into the multilayer structure consisting of the high-hardness conductor layer 4a2 .</p> |
