| 摘要 |
<p>PURPOSE: To provide a compression-contact semiconductor device wherein alignment of an anode thermal compensation board and a cathode thermal compensation board is facilitated, fitting is not generated, peeling at the time of molding is not generated, and heat dissipation is excellent, by improving the shape of an insulator formed along the outer peripheral end edge and the main surface of a semiconductor substrate. CONSTITUTION: In the compression-contact semiconductor device, an inner periphery of a ring-shaped insulator 22 which is formed along the whole peripheral end edge and the main surface of a semiconductor substrate 6 in which a PN junction is formed has a tapered part 22a in the inner peripheral direction and a vertical part 22b which forms a vertical inner peripheral diameter continuous to the tapered part 22a.</p> |
