| 摘要 |
<p>PURPOSE: To maintain the mounting height of a semiconductor device, mounted on a mounting board, at a constant height, to reduce a stress to a connecting part, to prevent a mounting defect and to mount the semiconductor device again by a method wherein a stud pin is installed on the semiconductor device. CONSTITUTION: Stud pins 10 having a predetermined length are fixed to a plurality of pads 8 formed on the mounting face of an insulating substrate 2 in a direction perpendicular to the mounting face of the insulating substrate 2. Then, spherical solder bumps 9 are formed so as to cover the stud pins 10. Thereby, the mounting height of a semiconductor device after its mounting operation can be maintained at a constant height without being inclined. Consequently, the heat dissipating characteristic of the semiconductor device is enhanced, a stress which is applied to the connecting part of the semiconductor device to a mounting board 13 can be reduced, a connecting defect is reduced, and the reliability of the semiconductor device is enhanced. In addition, a through hole which is used to mount a conductor pin is not required, and a high-density wiring operation can be performed.</p> |
